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Home > Products > Industrial Motherboard > Desktop Platform > ZO-H110PA-12C
ZO-H110PA-12C
Detailed
Support Intel ® 7th & 6th Gen Core™ i Processor (LGA1151) TDP65W
Intel® H110 Chipset
Two 260-pin SO-DIMM up to 32GB DDR4 2400/2133 MHz SDRAM
Support VGA/HDMI/eDP display output,(Support synchronous/asynchronous display
Support 4 x USB 3.0, 12 x USB 2.0,
Support 2 x SATAIII,1 x mSATA
11 x RS232, 1 x RS232/422/485
Support M.2 WIFI and 3G/4G module at the same time
Line-in, Mic-in, Line-out
Support for PCIe x1 (Gen 3) expansion interface
0755-83650405 Online inquiry
Specification parameters
Interface
Data download
CPU Support  Intel LGA1151 series Rear I/O 2*LAN
Chipset H110 4*USB3.0
GPU INTEL Built in Display Core 10*USB2.0
Display VGA 、HDMI、EDP 1*VGA
Muilt
Display
VGA+HDMI/HDMI+EDP/VGA+EDP 1*HDMI
USB synchronous/asynchronous display 1*AUDIO
4*USB3.0+10*USB2.0 1*PS2
RAM 2*SO-DIMM  DDR4  2133/2400MHz  32GB Internal I/O 1*F-AUDIO PIN
Audio Onboard Realtek ALC662H
+NS4258 Chip Output power: 3.2W× 2(4Ω Load), 5.2W × 2(2Ω Load)
1*SPEAKER PIN
3*COM_CONN PIN(12*COM232,COM2 RS422/485 optional)
Network Onboard 2*Realtek RTL8111H Gigabit LAN 1*F_PANEL PIN
Storage 2*SATA3.0     1*M-SATA (Sata SSD) 2*SATA
WIFI 1*MINIPCIE (for 3G/4G)  1*GPIO1 PIN
 1*M.2 NGFFA (For WIFI+Bluetooth) 1*SYS-FAN PIN
I/O Chip 2*ITE8786E-I 1*CPU-FAN PIN
BIOS AMI  BIOS 1*20PIN ATX PIN
Power 4PIN ATX /20PIN ATX   1*4PIN ATX PIN
Cooling Need Self-equipped 115X CPU and FAN 1*SIM Expansion slot
Operating -10~60℃; 0% ~ 95% relative humidity,Non-condensing 1*FPC1(EDP)
Size 170X170MM 1*PCIe X1 Expansion slot

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7th Floor, Building 6, Hengda Fashion Huigu,
Henglang Community, Dalang Street,
Longhua District, Shenzhen
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